The quantum and chemical simulation (HF/MP2, cc-pVDZ basis) of diphenyl-2,2',4,4'-tetraamine (DPTA) molecule properties allows to determine the its thin film pyroelectric properties since hydrogen bonds between molecules in the film are weaker than intramolecular bonds. The study of a DPTA photosensitive pyroelectric film microstructure enables one to assume that the dipole moment of the needle-shaped crystallines densely stacked and extended along a film surface is aligned perpendicularly to the surface. The possibility of the reproduced control for DPTA properties may be used when producing the most effective pyroelectric film for photodetectors in infrared wavelength range.

Keywords: Diphenyl-2,2',4,4'-tetraamine, quantum chemical simulation, pyroelectric material, thin-film structure

  Laboratory technology was developed to fabricate flexible piezocomposites with ferroelectric phase - polymers having signal reception factorv • gv 5000 • 10-15 m2 / N. The values of the given coefficient were achieved by switching from a probabilistic (spontaneous) percolation to a correlated one in the process of forming material. This made the production of 0-1–3 piezocomposites, in which a part of piezophase has 0 connectivity, and the other part – 1 connectivity possible. To improve the efficiency of piezocomposite polarization before their manufacturing the surface of piezophase particles, which were obtained by the partial destruction of the porous frameworks, was treated with coupling agent, which did not only improve the polymer adhesion to piezophase, but also allowed the removal of water from the particle surface. The latter effect reduced the value of interfacial conductivity, i.e. prevented the voltage drop of the polarizing field. Matching of polymer conductivity and piezoceramic particles by determining the optimal polarization temperature was carried out as well.  

Keywords: piezocomposites, percolation, connectivity, electrophysical properties

  This article discusses the technology developed in Russia, internal mounting elements (crystal chip) on the printed circuit board (PCB). Due to a number of advantages, in many cases, the internal assembly is able to replace the classical surface-mount technology. authors also provides the development for implementation of considered technology on flexible printed circuit boards.

Keywords: internal installation; conformal boards; polyimide; frameless crystals; printed circuit board